Handbook Of Wafer Bonding
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Handbook Of Wafer Bonding

by Peter Ramm

Written by an author and editor team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. In the first part, researchers from companies and institutions around the world discuss the most reliable and reproducible technologies for the production of bonded wafers. The second part is devoted to current and emerging applications, including microresonators, biosensors and precise measuring devices.

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Product Details

  • Number of Pages : 425
  • Publisher : John Wiley
  • Weight : 972g
  • Product Code : 9783527326464